Efficient AFM Sample Preparation Using the MicroSupport AxisPro: Precise Micro-Sample Handling and Mounting Techniques
Technical
As materials research, semiconductor analysis, and micro-scale characterization continue to advance, there is an increasing…
Precision Micro-Particle Handling: From Targeted Particle Extraction to Vacuum Transfer of Industrial Particles
Technical
Handling microscopic particles presents significant challenges in analytical, research, and industrial environments. At micro-scale dimensions,…
Soil Flux Analysis with ABB LGR-ICOS Laser Gas Analyzers
Technical
Accurate measurement of greenhouse gas exchange between soils and the atmosphere represents one of the…
Real-Time Gas Flux Analysis for Capturing Transient Soil Emission events
Technical
Soil greenhouse gas emissions rarely occur at steady, predictable rates. Instead, many of the most…
Thermal Conductivity Testing: A Guide to Methods, Applications, and Instrument Selection
Technical
Image Credit: www.hotdiskinstruments.com A single thermal management failure can halt production, fail regulatory testing, or…
Pinpoint Collection of Foreign Particles in Paper Fibers (30–100 µm) Using Precision Micro-Manipulation
Technical
Image Credit: https://www.microsupport.co.jp/ Contamination analysis in paper manufacturing, packaging materials, specialty papers, and research applications often…
How Axis Pro Enables Precise and Repeatable Surface Sample Preparation?
Technical
Image Credit: https://www.microsupport.co.jp/ Precise sample preparation is essential in materials analysis because it directly influences the…
Barnett Technical Services at M&M 26: Advanced Microscopy and Precision Micromanipulation Solutions
Conferences
Barnett Technical Services (BTS) is pleased to announce our participation in the 66th Annual Microscopy…
Barnett Technical Services to Attend ITCC/ITES 2026: Advancing Thermal Analysis in Ceramics
Conferences
We have exciting news to share. Barnett Technical Services (BTS) will be attending the International…
Micro Spot Welding for Fine Metal Wires (30–100µm): Precision Wiring Connection and Modification for Advanced Applications
Technical
Miniaturization has become the engineering standard for a wide range of circuitry applications. Across microelectronics,…