
Precision Marking and Lift-Out Techniques for Advanced Failure Analysis and Sample Preparation
As semiconductor devices, electronic components, and advanced materials become increasingly




State-of-the-art Micromanipulation systems for your research needs.

Fast, non-destructive thermal analysis of a wide range of materials

State-of-the-art polariscope technology for precise
stress and strain analysis.






State-of-the-art Micromanipulation systems for your research needs.

Fast, non-destructive thermal analysis of a wide range of materials

State-of-the-art polariscope technology for precise
stress and strain analysis.


We have a broad range of applications including the fields below. If you do not see your application or have additional questions, please contact us.








September 30, 2024
Stress and strain analysis hold a huge importance in quality…
December 5, 2019
MicroSupport Micromanipulator for Separation of Paint Layers in Trace Analysis.…
December 22, 2020
We are very excited to be attending the AIC FAIC…
February 16, 2026
The measurement and tracking of greenhouse gases has become one…
November 1, 2023
Visit us at the 2023 Glass Problems ConferenceNov 6-8, Columbus,…
We had the first North American MicroSupport Users Meeting on…
May 1, 2023
July 10, 2022
We are glad to share the news about the implementation…
October 24, 2017

As semiconductor devices, electronic components, and advanced materials become increasingly

Image Credit: https://www.microsupport.co.jp/ Resistance measurement and continuity testing are widely used

Image Credit: https://www.microsupport.co.jp/ Advanced materials research continues to move toward smaller

Image Credit: https://www.microsupport.co.jp/ As materials research, semiconductor analysis, and micro-scale characterization

Image Credit: https://www.microsupport.co.jp/ Handling microscopic particles presents significant challenges in analytical,

Accurate measurement of greenhouse gas exchange between soils and the