
Precision Marking and Lift-Out Techniques for Advanced Failure Analysis and Sample Preparation
As semiconductor devices, electronic components, and advanced materials become increasingly




State-of-the-art Micromanipulation systems for your research needs.

Fast, non-destructive thermal analysis of a wide range of materials

State-of-the-art polariscope technology for precise
stress and strain analysis.






State-of-the-art Micromanipulation systems for your research needs.

Fast, non-destructive thermal analysis of a wide range of materials

State-of-the-art polariscope technology for precise
stress and strain analysis.


We have a broad range of applications including the fields below. If you do not see your application or have additional questions, please contact us.








May 17, 2017Luceo Fullauto StrainEye LSM-9000s Fullauto StrainEye LSM-9000S is a fully…
December 29, 2025Image Credit: www.cordouan-tech.com Lipid nanoparticles (LNPs) have become a cornerstone…
February 3, 2019
April 6, 2026Barnett Technical Services (BTS) is pleased to announce our participation…
February 23, 2020Elk Grove, CA – art photonics GmbH and Ostec announce…
March 23, 2023We are very excited to be attending Microscopy & Microanalysis 2023…
October 3, 2025The study of internal stress in transparent materials such as…
March 15, 2021Polymers and Materials for Additive Manufacturing To learn more about…
June 11, 2026Image Credit:Â https://www.microsupport.co.jp/ Precise sample preparation is essential in materials analysis…
We had the first North American MicroSupport Users Meeting on…

As semiconductor devices, electronic components, and advanced materials become increasingly

Resistance measurement and continuity testing are widely used to evaluate

Advanced materials research continues to move toward smaller feature sizes,

As materials research, semiconductor analysis, and micro-scale characterization continue to

Handling microscopic particles presents significant challenges in analytical, research, and

Accurate measurement of greenhouse gas exchange between soils and the