Barnett Technical Services to Attend ITCC/ITES 2026: Advancing Thermal Analysis in Ceramics
We have exciting news to share. Barnett Technical Services (BTS) will be attending the International Thermal Conductivity Conference and International Thermal Expansion Symposium (ITCC/ITES 2026) this fall. It is one of the most significant gatherings in thermophysical materials testing, and we are genuinely looking forward to being part of it.
Thermal conductivity and thermal expansion are not abstract measurements. For ceramics, these properties determine whether a material holds up in a jet engine, performs reliably in a semiconductor package, or survives thermal cycling in an energy system. The events like ITCC/ITES brings together researchers, engineers and industry professionals who focus on thermal conductivity and thermal expansion.
As a company that represents Hot Disk® products, attending this conference is a natural fit for us. Hot Disk® has long been a trusted name in thermal analysis, and ITCC/ITES is exactly the kind of environment where those conversations come alive.
About ITCC/ITES 2026
ITCC/ITES 2026 is the combined meeting of two premier international conferences: the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES). Together, they form one of the most respected gatherings focused on the thermophysical properties of materials.
The conference is scheduled for September 29 through October 1, 2026, and will be held in Westerville, Ohio, at the Renaissance Columbus Westerville-Polaris Hotel. This year’s event carries special significance: it marks a homecoming of sorts. The very first ITCC was held in Columbus, Ohio, in 1961, and in 2026 the conference returns to its roots.
The event is hosted by The American Ceramic Society and co-hosted by the Edward Orton Jr. Ceramic Foundation and Hot Disk® AB, two organizations with deep ties to thermal analysis in ceramics. Researchers, engineers, and industry professionals from across the globe will come together to exchange knowledge on thermal conductivity, diffusivity, expansion, and related phenomena.
For full event details, visit the official event page: ITCC/ITES 2026 on ceramics.org
Why This Event Matters
Consider this: Many materials fail, not due to mechanical weakness, but because their thermal behavior wasn’t measured accurately. It happens more than most people realize. Ceramics are used in some of the most demanding environments on earth. For instance,
- In aerospace, they are found in thermal protection systems and engine components where temperature resistance is non-negotiable.
- In electronics, ceramic substrates and packaging materials must conduct or resist heat with extreme precision.
- In energy applications, from fuel cells to nuclear systems, ceramic components face relentless thermal stress.
- In automotive and advanced materials development, the push for lighter and more heat-tolerant parts is constant.
In each of these industries, getting thermal analysis right is not optional; it is foundational. ITCC/ITES brings together the people who are doing this work at the highest level. That is what makes this conference worth showing up for.
Barnett Technical Services at ITCC/ITES 2026
The BTS team will attend ITCC/ITES 2026. For us, this is not just about being present at an industry event. It is about being part of a community that is actively shaping how thermal analysis is done.
We believe that the best learning happens in real conversations. Conferences like this one put researchers, engineers, and solutions providers in the same room, and that kind of direct exchange is genuinely valuable. We come to these events to listen as much as to share.
As representatives of Hot Disk® products, we are particularly interested in connecting with professionals who work with ceramic materials and are looking at more efficient, reliable ways to measure thermal properties. Hot Disk® instruments are well-suited for exactly these applications, and we are always eager to discuss how they fit into real-world testing workflows.
Hot Disk® Technology and Its Role in Ceramic Thermal Analysis
Hot Disk® instruments use the Transient Plane Source (TPS) method for measuring thermal conductivity and diffusivity. If you have worked with ceramics before, you know that getting reliable measurements from these materials is not always simple. They are often brittle, highly variable in structure, and sensitive to how a sample is prepared and handled.
What stands out about the Hot Disk® approach is its versatility. It handles both conductivity and diffusivity measurements without requiring different setups or instruments. This alone saves significant time. The technique is also non-destructive, which matters a great deal when working with precision ceramic samples that cannot be sacrificed for a single data point.
Beyond ceramics, Hot Disk® systems are used across a wide range of advanced materials including composites, polymers, metals, and thermal interface materials. This versatility is useful at a conference like ITCC/ITES, where the attendee base is diverse and the conversations tend to cross material boundaries fairly quickly.
From an industry standpoint, having a measurement method that is versatile, non-destructive, and capable of handling complex material types is genuinely helpful. It reduces bottlenecks in development pipelines and gives researchers more confidence in their data.
What We Look Forward To
Honestly, the best part of any conference is the conversations that happen outside the formal sessions. Someone mentions a measurement challenge they have been stuck on, and a completely different perspective opens. This kind of exchange is hard to replicate anywhere else.
We are looking forward to hearing from researchers on the frontlines of ceramic materials development. We want to understand what is working, what is not, and where the field is heading. The keynote and plenary sessions always surface ideas worth thinking about long after the conference ends.
Networking is, of course, a big part of it too. Building and maintaining relationships with industry peers, researchers, and institutions is something we take seriously. The thermal analysis community is a close-knit one, and events like ITCC/ITES are where those professional connections deepen over time.
Are You Attending ITCC/ITES 2026? Let’s Connect.
ITCC/ITES 2026 is shaping up to be a genuinely important event for anyone working in thermal analysis, and we at Barnett Technical Services are proud to be attending. It reflects something we believe in, which is staying engaged, curious, and connected to the community we serve.
Our commitment to the thermal analysis industry is ongoing. Whether it is through the solutions we provide, the technical conversations we have, or the events we attend, we want to be a meaningful presence in this space. ITCC/ITES 2026 is one more way we live up to that commitment.
Learn More:
If you are also attending the conference this September in Westerville, Ohio, we would love to connect. Come find us, start a conversation, and let’s talk thermal analysis.