Structural Probe Measurement Module

With our add-on Structural Probe Measurement Module, the Hot Disk® Instrument user can measure the Thermal Conductivity as a function of depth into relevant samples, ranging from sub-millimeter up to plural centimeter formats. This unique capability offers a powerful tool for QC testing, as homogeneity, defect detection or analysis of inhomogeneous substances, inside a sample or component, can thus be tested non-destructively. Examples of components include rubber tires, brake pads, and graphite-epoxy structures.

InstrumentsRange
TPS 3500, TPS 2500 S0.03 to 500 W/m/K