LSM-9001NIR
Evaluate strain with 2D distribution of low phase difference samples such as semiconductor wafers, colored glass, and colored acrylic resin products. Evaluate up to approx. 50 x 50 mm in 1 minute. Fully automatic measurement reduces work and measurement errors by the measurer. This is capable of performing strain evaluating of semiconductor wafers, colored or transparent products, residual stress, and cracks that are impossible to measure with conventional polariscope.
Target Products | Si / SiC / GaN / Glass wafer/ Transparent/colored resin products/ Crystallized quartz / Quartz / Optical crystals |
Inspection Method | NIR Rotating Analyzer Method |
Measurement Range (approx.) | 0~150nm (Retardation) |
Measurement area size | (approx.) 50×50mm |
Measurement object placement space (height) | Max 160mm |
Size | W300 ☓ D353 ☓ H540 mm |
Weight | 22 kg |
Others | Light Source:high-luminanceLED PowerSorce:AC100~240V 50/60Hz DC input 24V 1.6A Component:Mainbody,PC,Cables Accessory:Main body cover OS:Windows10 Pro (64bit) English |