Milling Pro
- Milling Pro MIL-1 cuts foreign objects embedded in materials like resin, a task which was too difficult.
- When attached to our micromanipulators (APFC/ APSS), Milling Pro enables cutting objects buried at depth of 2-300 µm with real-time visual monitoring
- The Milling Pro kit includes dedicated cutting tools with various cutting area and depth controls.
- Milling Pro is an adjustable/flexible cutting tool that can be used for a wide range of materials, including resin, glass, silicon wafers, ferrous and non-ferrous metals, and rocks.
- Micro IR (microscopic IR) and thinning of foreign particles embedded in resin material
- Flat cutting of embedded foreign substances (preparation for ATR measurements)
- Micron-level step cutting of thin film on resin surface
- Flat cutting of a wide range of surfaces at a fixed depth (from 50µm square)
- Marking on glass, wafer, and metal samples (for FIB processing)
- Pinpoint cutting of IC packages and LCD panel encapsulation materials
- Contact with internal defect (sample pretreatment for X-ray microscopy or ruler drawing on an IC chip)
Semi – automated surface cutting operations enabled by Axis Pro`s control program
Semi – automated surface cutting operations enabled by Axis Pro`s control program
Semi – automated surface cutting operations enabled by Axis Pro`s control program.
Semi – automated surface cutting operations enabled by Axis Pro`s control program.
| Controller unit | 85(W)×290(D)×140(H)mm, 3kg |
| Milling unit | φ28×140(L)mm, 0.2kg |
| Power supply | AC100～230V 50/60Hz |
| Rated power consumption | 25VA |